China Readying $143 Billion Package for Its Chip Firms in Face of U.S. Curbs

China is working on a more than 1 trillion yuan ($143 billion) support package for its semiconductor industry, three sources said, in a major step towards self sufficiency in chips and to counter U.S. moves aimed at slowing its technological advances.

from Top Tech News- News18.com https://ift.tt/PeJwN1V